論文提要內容：
        本研究的重點是提高專門為了影片編輯和3D建模設計的高性能筆記型電腦冷卻模組的功率容量(power  capacity)。其中是在 Compal Electronic Company 的熱對策部門實習期間專門使用 Dell Precision 筆記型電腦進行。
增加冷卻系統功率容量對筆記型電腦性能的直接影響。 原裝散熱模組支持 30W 的 CPU 容量和 60W 的 GPU 容量。 通過增加冷卻系統功率容量， 可以顯著提高筆記型電腦的性能。 
為滿足這一需求而進行了設計修改，主要集中在熱管、CPU區域的散熱片和風扇尺寸調整上。 在完成這些改進後，創建了一個 3D 模型（本文稱為 design of experiment 1( DOE1) 模塊）並在生成物理原型之前進行了模擬。 接續在實驗中針對原始散熱模組進行測試。 
將  design of experiment 1 (DOE1) 模組與原始散熱模組進行比較的結果表明，冷卻系統的能力從 30W CPU 和 60W GPU 增加到 30W CPU 和 84.9W GPU。 這表明擴大風道、增加散熱器和增加風扇尺寸有效地增強了系統的冷卻能力。 應該注意的是，這些設計修改受到每台筆記型電腦的特定限制所施加的限制，例如用於擴展組件的可利用空間。

This study focuses on enhancing the power capacity of the cooling module in a high-performance workstation laptop designed for video editing and 3D modeling tasks. The research was conducted during an internship at Compal Electronic Company's Thermal Department, specifically working with the Dell Precision workstation laptop.
The direct impact of electricity on laptop performance creates a need to improve the cooling system's power capacity. The initial thermal module could support a CPU power of 30W and a GPU power of 60W. Performance on the laptop can be sharply increased by raising the capabilities. Design modifications were made to address this need, primarily focusing on heat pipes, heatsinks in the CPU area, and fan size adjustments. After finalizing these improvements, a 3D model (referred to as the design of experiment 1 (DOE1) module) was created and simulations were conducted before producing the physical prototype. The prototype was then tested against the original thermal module in practical experiments.
The experimental results comparing the design of experiment 1 (DOE1) module with the original module demonstrated an increase in the cooling system's capability from 30W CPU and 60W GPU to 30W CPU and 84.9W GPU. This indicates that enlarging the duct, adding a heatsink, and increasing the fan size effectively enhances the cooling capacity of the system. It should be noted that these design modifications are subject to limitations imposed by each laptop's specific constraints, such as available space for scaling up components.

Table of Contents
Acknowledgment	I
Abstract	II
Content	V
Figure of content	VIII
Figure of content	IX
Table of content	X
Chapter 1 Introduction	1
1.1. Introduction of internship	1
1.2 Company Introduction	2
1.3 Background	3
1.4	Purpose	5
1.5 Scope of work	5
Chapter 2 Technology and literature review	6
2.1 Technology review	6
2.1.1 Central Processing Unit (CPU)	6
2.1.2 Graphics Processing Unit (GPU)	11
2.2 Theory review	13
2.2.1 Conduction:	15
2.2.2 Convection:	16
2.2.3 Radiation:	17
2.2.4 Steady state conduction	18
2.2.5 Transient heat conduction	26
2.2.6 Fundamental of convection	26
2.3 Literature review	29
2.3.1 Heat pipe	29
2.3.2 Vapor chamber	38
2.3.3 Heat sink	39
Chapter 3 Experiment and Simulation	42
3.1	Procedure Flowchart	42
3.2 3D model & Simulation	44
3.2.1 3D model of original module.	44
3.2.1.1 Dimensions of sections in the original module.	45
3.2.2 Design of experiment 1(DOE1) model.	49
3.2.2.1 Dimensions of sections in the original module.	52
3.3 Setting and boundary condition in simulation.	57
3.4 Experimental and Experimental setting	60
3.4.1 Experimental tools	61
3.4.2 Experiment	62
3.4.2.1 Experiment 1	62
3.4.2.2 Experiment 2	62
3.4.2.2 Experimental 3	64
Chapter 4 Result and comparison	61
4.1 Simulation result	61
4.1.1 Simulation 1 result for original module	61
4.1.2 Simulation 2 result for original module	62
4.1.3 Simulation 3 result for design of experiment (DOE1) module	63
4.2 Experimental results	64
4.2.1 Experimental 1 results	64
4.2.2 Experiment 2 results	66
4.2.3 Experimental 3 results	68
4.3 Comparison	70
4.3.1 Validate between simulation of original module with experimental 1.	70
4.3.2 Comparison between simulation 1 with simulation 2.	71
4.3.3 Comparison between experimental 1 with experimental 2	71
4.3.4 Comparison between experimental 2 with experimental 3	72
Chapter 5 Conclusion and Discussion	72
5.1 Conclusion	72
5.2 Discussion	73
Reference	74
List of Figure
Figure 2. 1 CPU Component (component that generate the heat)	9
Figure 2. 2 Component of GPU	13
Figure 2. 3 a) The flow rate of the fluid passing through the face area b) Under steady conditions.	14
Figure 2. 4 conduction heat transfer	15
Figure 2. 5 Convection heat transfer	17
Figure 2. 6 Heat transfer through a wall is one dimensional.	19
Figure 2. 7 Schematic for convection resistance	20
Figure 2. 8 Thermal resistance network for heat transfer through two-layer	21
Figure 2. 9 Typical experimental for find thermal contact resistance.	22
Figure 2. 10 Volume element of a fin	23
Figure 2. 11 Fin enhances heat transfer.	24
Figure 2. 12 Various formulas and translators used to calculate each fin	25
Figure 2. 13 Heat transfer from a hot surface to the surrounding fluid by convection	26
Figure 2. 14 a) cylindrical heat pipe. b) flattened heat pipe.	32
Figure 2. 15 Schematic of thermal resistance in paper	34
Figure 2. 16 Thermal resistance with heat dissipation	34
Figure 2. 17 Concept design for leading edge of heat pipe	35
Figure 2. 18 Schematic finned flat heat pipe.	36
Figure 2. 19 Vapor chamber solution	38
Figure 2. 20 schematic heat sink assembly	40
Figure 2. 21 Heat sink model	40 
List of Figure
Figure 3. 1 Procedure flowchart	42
Figure 3. 2 Original Thermal module from dell precision 7780	44
Figure 3. 3 3D disassembles model of original module.	44
Figure 3. 4 Heat pipe	45
Figure 3. 5 CPU die casting and CPU block dimension.	46
Figure 3. 6 GPU die casting and GPU block dimension.	46
Figure 3. 7 Fan cover dimension.	47
Figure 3. 8 Fin dimension.	47
Figure 3. 9 Fan and Fan direction dimension	48
Figure 3. 10 3D disassembles model of design of experiment 1 (DOE1) module.	49
Figure 3. 11 a) original module design b) design of experiment 1(DOE1) design	50
Figure 3. 12 Heat pipe dimensions.	52
Figure 3. 13 CPU die casting and CPU bolck dimensions	53
Figure 3. 14 GPU die casting and GPU block dimensions.	53
Figure 3. 15 Fan cover dimensions.	54
Figure 3. 16 Fin dimensions.	54
Figure 3. 17 Fan and Fan direction dimensions.	55
Figure 3. 18 Heat Sink dimensions	55
Figure 3. 19 Boundary condition setting in simulation program (Simcenter Flotherm). 	58
Figure 3. 20 Substant in simulation program (Simcenter Flotherm).	58
Figure 3. 21 CPU&GPU power setting in simulation program	59
Figure 3. 22 Acoustic level setting in simulation program	59
Figure 3. 23 Chamber for control various in experimental	60
Figure 3. 24 a) Furmark Tool    b) GPU monitor	61
Figure 3. 25 Locations that were installed thermocouple in original module.	64
Figure 3. 26 Locations that were installed thermocouple in design of experiment 1 (DOE1) module.	65
List of Tables
Table 2. 1 Interl CPU used in Dell Precision 7000 series (History)	9
Table 2. 2 NVIDIA graphics card for workstation laptop	12
Table 3. 1 Details of the information in original module.	45
Table 3. 2 Sizes of sections in original module	48
Table 3. 3 Parameters that use in case studies.	51
Table 3. 4 Details of the information in design of experiment 1 (DOE1) module	52
Table 3. 5 Sizes of sections in DOE1 module.	56
Table 3. 6 Boundary conditions in simulation program (Simcenter flotherm)	57
Table 3. 7 Setting material on simulation program (Simcenter flotherm)	57
Table 3. 8 Experiment 1 setting in original module.	62
Table 3. 9 Experiment 2 setting in original module.	63
Table 3. 10 Experiment 2 setting in design of experiment 1 (DOE1) module.	65
Table 4. 1 Simulation 1 result for original module	61
Table 4. 2 Simulation 2 result for original module	62
Table 4. 3 Simulation 3 result for design of experiment (DOE1) module	63
Table 4. 4 Experimental 1 result	64
Table 4. 5 Power behavior in the system that use original module.	65
Table 4. 6 Experiment 2 result.	66
Table 4. 7 Power result when increase GPU power in system.	67
Table 4. 8 Experimental 3 result	68
Table 4. 9 Power result when increase GPU power in system (design of experiment1 (DOE1) module).	69
Table 4. 10 Comparison the result between original module in experimental 1 and experimental2	71
Table 4. 11 Comparison the result between original module in experimental 2 with design of experiment3 (DOE 1) module	72
Table 4. 12 The graph shows the power capability comparison of original module and design of experiment 1 (DOE1) module	73

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