本研究旨在研究筆記型電腦散熱鰭片的幾何尺寸變化對於高效能活動（如遊戲或影像製作）時的散熱效能有何影響。此研究是在仁寶公司 (Compal)熱部門實習期間進行，專注於戴爾公司(Dell)新款G系列遊戲筆記型電腦。
模擬和實際實驗所得結果顯示，修改後的筆記型電腦散熱鰭片在散熱性能方面有顯著改善。後部鰭片幾何尺寸的變化提升了散熱能力，從而在高效能活動（如遊戲或影像製作）期間降低了關鍵元件的溫度。
三維模型模擬表明，修改後的設計有效增加了散熱傳遞的表面積，並改善了鰭片的氣流通過情況。這種優化的散熱效果使得溫度降低，整體系統穩定性提高，減少了熱節點和潛在性能下降的風險。實際原型進一步驗證了模擬結果，顯示在高工作負載條件下筆記型電腦的溫度明顯降低。通過與原始熱模塊的比較，改進後的原型展示了更高的散熱性能。

This study aimed to determine how the laptop heat dissipation fins, which are most used for high-performance activities like gaming or producing video functions when their geometrical dimensions are varied. The research was conducted during an internship at the Thermal Department of Compal Electronic Company, particularly with the Dell new G series gaming laptop. The results obtained from the simulations and real experiments showed significant improvements in the thermal performance of the modified laptop heat dissipation fins. The variations in the geometrical dimensions of the rear side fins led to enhanced heat dissipation capabilities, thereby reducing the temperature of critical components during high-performance activities such as gaming or video production. The 3D model simulations demonstrated that the modified design effectively increased the surface area available for heat transfer and improved airflow through the fins. This optimized heat dissipation resulted in lower temperatures and improved overall system stability, reducing the risk of thermal throttling and potential performance degradation. The physical prototypes further validated. 


the simulation results, showcasing a notable reduction in the temperature of the laptop under high workload conditions. The improved prototype's increased cooling performance has been shown by comparing it against the original thermal module

Table of Content
	
Acknowledgement	I
Table of Content	V
Lists of Figures	VII
Lists of tables	IX
Chapter 1: Introduction	- 1 -
1-1 Introduction to the internship institution	- 1 -
Compal Electronics product and market overview	- 2 -
1-2 Internship overview	- 3 -
Internship Experience and Self-Expectation	- 5 -
Experiences and duties	- 5 -
1.3 Purpose	- 9 -
1.4	Scope	- 9 -
Chapter 2: Literature Review	- 10 -
2.1 Basic information about cooling systems in notebook.	- 11 -
2.2 Equations and principles	- 15 -
2.2.1 Fourier’s Law and Thermal Resistance	- 15 -
2.3 Related equations of thermal resistance for cooling laptop	- 16 -
2.4 Electronic cooling simulation software	- 18 -
Chapter 3: Experiment design	- 22 -
3.1 3D model & Simulation	- 23 -
3.2 Experiment setup for prototypes.	- 27 -
Chapter 4: Result Analysis	- 32 -
4.1 Heatsink simulation results.	- 32 -
4.1.1 Heatsink experiment results.	- 34 -
4.1.2 Comparison of heatsink in simulation and experiment.	- 35 -
4.2 The entire system simulation.	- 37 -
4.2.1 The entire system experiment.	- 38 -
4.2.2 Comparison of the entire system in simulation and experiment.	- 40 -
Chapter 5: Conclusion	- 43 -
References	- 44 -

 
Lists of Figures
Figure 1 symbol of compal electronics	- 1 -
Figure 2 Products of compal electronics	- 1 -
Figure 3 I-scan	- 6 -
Figure 4 IR camera	- 6 -
Figure 5 Thermal test	- 7 -
Figure 6 Wind tunnel (air flow measuring equipment)	- 7 -
Figure 7 CPU	- 11 -
Figure 8 Heat pipe	- 11 -
Figure 9 Heatsinks.	- 12 -
Figure 10 Fan	- 12 -
Figure 11 Thermal Pads and Thermal Paste	- 13 -
Figure 12 Air flow paths	- 13 -
Figure 13 Fan control app interface	- 14 -
Figure 14 Simcenter Flotherm software	- 18 -
Figure 15 Flotherm's interface	- 18 -
Figure 16 Heat analysis of flotherm	- 19 -
Figure 17 Materials and property libraries	- 19 -
Figure 18 The modeling of heat sources in Flotherm	- 20 -
Figure 19 Command center Flotherm	- 20 -
Figure 20 Flow chart of the plan	- 22 -
Figure 21 Dell New G16 gaming laptop	- 23 -
Figure 22 Thermal module	- 24 -
Figure 23 3D model of thermal module	- 25 -
Figure 24 Optimizing the length of the rear fins in the thermal module	- 25 -
Figure 25 Command center	- 27 -
Figure 26 prototypes	- 27 -
Figure 27 temperature sensors	- 28 -
Figure 28 Sensors connector	- 29 -
Figure 29 temperature sensors monitoring	- 29 -
Figure 30 CPU stress test	- 30 -
Figure 31 GPU stress test	- 30 -
Figure 32 The distribution of temperatures in simulation	- 32 -
Figure 33 Graph of temperature sensors in simulation	- 33 -
Figure 34 Graph of conducted heat	- 33 -
Figure 35 Graph of temperature sensors in experiment	- 35 -
Figure 36 Graph of temperature sensors in experiment	- 37 -
Figure 37 Graph of temperature sensors in the entire system simulation	- 38 -
Figure 38 Graph of temperature sensors in the entire system experiment	- 40 -
Figure 39 Comparison graph of CPU, GPU temperatures in the entire system	- 41 -
 
Lists of tables
Table 1 fans setting	- 25 -
Table 2 Heat sources setting	- 26 -
Table 3 Boundary conditions in simulation program	- 26 -
Table 4 temperature results from simulation	- 32 -
Table 5 Temperatures data from experiment	- 34 -
Table 6 Comparison data of heatsink simulation and experiment	- 35 -
Table 7 Temperatures data from the entire system simulation	- 37 -
Table 8 Temperatures data from the entire system experiment	Error! Bookmark not defined.
Table 9 Comparison data of the entire system simulation and experiment	- 40 -
Table 10 % Error of the simulation and experiment	- 41 -

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