本研究係使用模擬軟體CoventorWare，分析一parylene為主體材料的三明治結構，對其進行熱電耦合的分析。
本文以改良由本研究群所研製之上電極式微幫浦於製作上諸多缺點，以在單一平面上加工之下電極式微幫浦，取代需要攀爬多層材料之上電極式微幫浦，以矽質材料作為底材，於晶圓背面施以濕蝕刻後，掏空濕蝕刻所形成之V型槽 （V-groove），以利電極做動裕度，並在晶圓正面上正光阻作為犧牲層（sacrificial layer）製作出一立體結構，利用parylene薄膜為結構層，來包覆住光阻犧牲層，在溶除光阻犧牲層後， 即完成一下電極式微幫浦。
在輸入方波電壓並通以DI water 加以驅動後，成功地在製作之PDMS流道中量測到液體流量，而作動溫度不但未超過50℃，及最大流量更可達23.8 nl /min，期待能以此低溫運作之特性，使應用面更為廣闊。

This study is using  coventorware to simulate a sandwich structure whtich mold by parylene. We also use this software to design and thermoelectric coupling.
This paper present the fabrication and analysis for a novel valveless micropump with working in a low temperature environment.We chose the parylene-c for the main material and success of production at an appropriate temperature which can drive a thermal actuating device. We Use TMAH to etch silicon wafer for the suspension pumping film, it may make a  Application at a novel micropump. Under the scale of micrometers, not only can actuate under 40℃ but also provide the velocity about 23.8 nl /min. In the future, it also can transport pharmaceuticals by the microchannel system with  micropumps.

目錄
中文摘要  I
英文摘要  II
目錄............................................................................................................III
圖錄..........................................................................................................VII
表目錄.....................................................................................................XII
第一章	 緒論............................................................................................1
1-1 研究動機.............................................................................3
1-2 文獻回顧.............................................................................4
1-2-1 parylene 微機電製程技術的回顧............................ 4
1-2-2 微幫浦技術回顧........................................................5
1-2-3 熱挫曲致動器之回顧................................................6
1-3 研究目的...........................................................................10
1-4 論文架構...........................................................................12
第二章 設計原理....................................................................................14
2-1聚-對二甲苯介紹...............................................................14
2-2 微流道之設計...................................................................16
2-3 無閥構型的設計...............................................................16
2-4 微幫浦驅動原理與分析...................................................18
   2-4-1薄膜變形分析……………………..……………..…18
第三章 Coventor ware軟體模擬分析與討論........................................20
3-1 Coventor ware簡介...........................................................20
3-2 準備程序...........................................................................21
3-3 結果與討論.......................................................................29
第四章 新型低溫熱挫曲微致動元件之下電極式微幫浦....................31
4-1上電極式微幫浦之探討與概述........................................31
4-1-1金屬鍍層之階梯覆蓋率問題..................................31
4-1-2 流道結構坍塌與損壞之問題.................................32
4-1-3 光阻擋牆結構產生破裂或缺陷.............................33
4-2 下電極式微型幫浦缺點改正...........................................35
4-3 製程設計...........................................................................37
   4-3-1 製造程序..................................................................38
4-4 後續工作...........................................................................43
   4-4-1 流道翻膜製程..........................................................44
第五章 製程結果與討論………………………………………………45
5-1 熱挫曲式微型幫浦製程結果...........................................45
   5-1-1 氧化層開洞.............................................................45
   5-1-2 晶圓背面蝕刻.........................................................47
   5-1-3 沉積底層聚對二甲苯薄膜.....................................50
   5-1-4 定義金屬舉離層.....................................................52
   5-1-5 沉積電極上層之聚對二甲苯薄膜.........................55
   5-1-6 定義流道犧牲層.....................................................55
   5-1-7 頂部沉積聚對二甲苯薄膜.....................................55
   5-1-8 淘空背面殘餘矽材與氧化層.................................56
   5-1-9 以SU-8翻製PDMS流道......................................60
第六章 量測與分析...............................................................................63
6-1 實驗架設說明..................................................................65
6-2 驅動量測………………………………………………..66
   6-2-1 乾式量測.................................................................66
   6-2-2 紅外線熱像儀表面溫度量測.................................71
6-2-3 理論值、模擬值與實際量測值之比較.................73
   6-2-4 濕式量測.................................................................76
   6-2-5 外接管路之改良.....................................................80
第七章 結論與未來方向.......................................................................82
7-1 結論..................................................................................82
7-2 未來方向與建議..............................................................83
參考文獻.................................................................................................84
附錄A  Parylene材料機械性質參數..................................................87
附錄B  SU-8與PDMS流道製程參數...............................................92
附錄C  Parylene材料機械性質參數...................................................93















圖目錄
圖 1-1全世界第一具微小馬達之掃描式電子顯微鏡照片....................2
圖 1-2由LIGA的技術製造出金屬熱挫曲致動器.................................6
圖 1-3方維倫教授提出以矽質材料開發出跳脫平面運動之熱致器....7
圖 1-4林宏樺所製作之熱挫曲微致動器................................................8
圖 1-5金屬佈線加熱後導致斷裂............................................................8
圖 1-6林岳正所製作之低溫熱挫曲微致動微幫浦................................9
圖 1-7 parylene微管壁在微加工過程中受損破裂導致氣泡進入..........9
圖 2-1聚對二甲苯沈積過程..................................................................15
圖 2-2聚對二甲苯N、C、D材料與化學結構......................................15
圖 2-3無閥幫浦上下震動時，淨流量往漸擴孔方向移動..................16
圖 2-4無閥幫浦構型..............................................................................17
圖 3-1分析介面概說圖..........................................................................21
圖 3-2 數值分析流程圖.........................................................................22
圖 3-3光罩設計之示意圖......................................................................23
圖 3-4 設定製造程序.............................................................................24
圖 3-5參數之設定..................................................................................25
圖 3-6欲分析之模型示意圖..................................................................25
圖 3-7網格分割設定..............................................................................26
圖 3-8網格分割示意圖..........................................................................27
圖 3-9運算後產生之參考數據示意圖..................................................28
圖 3-10通以2伏特電壓時薄膜結構之變形示意圖............................29
圖 3-11施加2伏特電壓於電極時之溫度分佈示意圖........................30
圖 4-1上電極式微幫浦..........................................................................31
圖 4-2電子蒸鍍機蒸鍍金屬..................................................................32
圖 4-3光阻定義出微流道與檔牆結構..................................................33
圖 4-4檔牆結構製作說明......................................................................34
圖 4-5檔橋已破壞導致氣泡進入腔體內部..........................................34
圖 4-6下電極式微幫浦未懸空之部位..................................................35
圖 4-7進出水孔與電極懸空部分相距約2000 μm.............................36
圖 4-8微幫浦薄膜空腔結構一覽圖......................................................37
圖 4-9製作微幫浦所需之光罩圖形......................................................40
圖 4-10下電極式微幫浦製作程序........................................................41
圖 4-11單顆元件光罩放大圖................................................................42
圖 4-12  SU-8光阻翻膜光罩圖............................................................43
圖 4-13光罩圖形放大圖........................................................................43
圖 5-1實驗架設圖..................................................................................45
圖 5-2將BOE滴覆於晶圓上................................................................46
圖 5-3氧化層開洞..................................................................................46
圖 5-4實驗架設圖..................................................................................47
圖 5-5 TMAH蝕刻後V型槽之外觀.....................................................48
圖 5-6晶圓周圍蝕刻後形成之缺口......................................................49
圖 5-7以光阻塗佈於矽晶圓周圍..........................................................49
圖 5-8晶圓周圍平整度極高..................................................................49
圖 5-9以丙酮舉離背面parylene...... .....................................................51
圖 5-10使用反應離子蝕刻機開洞後之全貌........................................51
圖 5-11以光阻定義金屬舉離層............................................................52
圖 5-12電子束蒸鍍機之顯示器............................................................53
圖 5-13蒸鍍金屬溫度過高導致parylene起泡....................................53
圖 5-14蒸鍍溫度改善後之電極全貌....................................................53
圖 5-15電極間距清晰可見....................................................................54
圖 5-16以SF6與CF4電漿蝕刻矽層與氧化層.....................................56
圖 5-17透過氧化層可觀察到進出水孔之流道犧牲層........................56
圖 5-18透過氧化層可觀察到懸空之金屬電極....................................57
圖 5-19背面矽質結構已完全移除........................................................57
圖 5-20金屬電極已懸空........................................................................58
圖 5-21噴嘴結構之光影變化................................................................58
圖 5-22噴嘴結構放大圖........................................................................59
圖 5-23電極上視圖................................................................................59
圖 5-24由光阻定義出之流道圖形........................................................60
圖 5-25將PDMS旋轉塗佈並加熱.......................................................61
圖 5-26鋪設廢棄晶片於PDMS表面已求得一真平面.......................61
圖 5-27脫模後之PDMS........................................................................62
圖 5-28將晶片與PDMS流道接合後之一覽圖...................................62
圖 6-1量測設備架設組織圖..................................................................64
圖 6-2探針檯使用狀況圖......................................................................65
圖 6-3外接電源設備圖..........................................................................65
圖 6-4薄膜光影之變化圖......................................................................66
圖 6-5光學干涉儀架設圖......................................................................67
圖 6-6變形量約為26～27 nm...............................................................68
圖 6-7模擬值與實際量測值之比較圖..................................................69
圖 6-8模擬值與實際量測值之比較圖..................................................70
圖 6-9模擬值與實際量測值之比較圖..................................................70
圖 6-10侷限量測區間一覽圖................................................................72
圖 6-11不同輸入電壓下所產生不同溫度之比較圖............................72
圖6-12金屬電極與電阻關係式符號表示圖.........................................73
圖6-13熱阻示意圖..................................................................................74
圖6-14模擬值、量測值與理論值之電極溫度比較圖...........................75
圖6-15流道層與晶片之爆炸視圖.........................................................76
圖6-16振動薄膜以及噴嘴結構上視圖.................................................77
圖6-17流道內液體運輸之連續拍攝圖.................................................77
圖6-18 parylene薄膜因電極加熱過劇，導致薄膜損壞.......................78
圖6-19以手工製作之轉接座極為粗糙.................................................79
圖6-20以鐵弗龍管作為外接管路.........................................................80
圖6-21於管路上黏貼刻度尺以便觀察..................................................80
圖6-22製作PDMS外接管路轉接座說明圖..........................................81
圖C-1 Parylene dimer克數與沉積膜厚對應曲線..................................93
圖D-1建立parylene特性參數................................................................94
圖D-2製程編排設定圖...........................................................................94
圖D-3運算進階設定一覽圖...................................................................95
圖D-4邊界條件設定一覽圖...................................................................95



表目錄
表6-1由1到10伏特電壓時，電流與功率之數據圖..............................74
表6-2 輸入0-6伏特電壓所驅動之流量比較表...................................78

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