本研究主要是設計並製造出可視化之平板式熱管，搭配去離子水做為工作流體，採用燒結厚度0.4mm、0.7mm與1.0mm的燒結銅粉做為熱管之毛細結構。平板式熱管在輸入功率20W、40W及60W之情況下，撘配不同的燒結厚度與一系列的填充率進行測試。實驗透過高速攝影機進行可視化觀察熱管內部熱傳機制對性能之影響，量測熱管各點溫度與計算蒸發熱阻，且有系統地檢測分析沸騰與蒸發時的條件參數對於熱管熱性能之影響程度。
    實驗的結果顯示輸入熱源、毛細燒結厚度與充填量，皆會影響熱源溫度與蒸發熱阻值等性能。燒結厚度0.4mm之毛細結構在輸入功率為60W時，有較佳的蒸發熱阻0.119℃/W。透過可視化觀察，發現液面會隨著熱通量增加而下降，在蒸發端之流體燒乾前，蒸發熱阻隨熱通量增加而逐漸降低至一最小值，且熱管內部之工作流體液面與毛細結構頂面的高低差，是影響蒸發端沸騰機制的主因。當液面高於毛細時，沸騰機制以池沸騰為主，且蒸發熱阻較高；當液面低於毛細時，伴隨著薄膜沸騰的發生會有較低的蒸發熱阻。

This study aims to design and fabricate a visualization flat plat heat pipe, with 0.4mm, 0.7mm and 1.0mm thick sintered copper wick structure. Three different sintering thicknesses of wicks with a series of filling ratio of deionized water were tested at heat input of 20W, 40W and 60W. Through a high-speed camera, the experiment was conducted to observe the boiling phenomenon of the evaporator in heat pipe.  Evaporation resistance was evaluated from the measured temperature to analyze the parameters impact on performance. 
    The experimental results showed that the flat plate heat pipe at the different heat input, with the different thicknesses of wicks and filling ratio, which would affect thermal performance of the module, such as temperature of heat source and evaporation resistance. At input power of 60W, the 0.4mm thick wick structure with 5% filling ratio has the lowest resistance of 0.119℃/W. Through visual observation, the liquid surface would descend when the heat flux increased, and the evaporation resistance could reach a minimum by increasing heat flux before drying out. We also found that the main reason for affecting the heat transfer mechanism is the height of working fluid inside the heat pipe. When the liquid surface is above the top of wicks, the mainly boiling mechanism is pool boiling with higher evaporation resistance, and a thin film boiling occurred with a lower resistance, when the surface is below the top of wicks.

目錄
中文摘要	I
英文摘要	II
目錄	III
圖目錄	VI
表目錄	VIII
符號說明表	IX
第一章緒論	1
1-1研究背景	1
1-2文獻回顧	2
1-2-1國內文獻	3
1-2-2國外文獻	6
1-3研究目的	10
第二章 理論簡介	11
2-1平板式熱管之原理與簡介	11
2-2熱管的特性與限制	12
2-2-1熱管性能與評估	12
2-2-2熱管之作動限制	12
2-2-3熱管之劣化因素	14
2-3工作流體	15
2-4毛細結構	17
2-5沸騰理論	17
2-5-1沸騰的基本模式	17
2-5-2成核理論	18
2-5-3池核沸騰表面粗糙度的影響	20
2-5-4薄膜蒸發熱傳	21
第三章 實驗方法與性能測試	23
3-1實驗設計	23
3-1-1實驗參數之設定	23
3-1-2可視化平板式熱管之設計	24
3-2實驗步驟	28
3-2-1實驗設備架設	28
3-2-2熱電偶線溫度校正	30
3-2-3內部管路清潔	30
3-2-4脫氣充填	31
3-2-5熱管性能測試	33
3-2-6計算實驗數據加熱平台	34
第四章 實驗結果與討論	36
4-1 無燒結毛細結構平板測試	36
4-2 厚度0.4mm燒結毛細結構平板測試	38
4-3 厚度0.7mm銅粉燒結結構-充填量比較	40
4-4 厚度1.0mm銅粉燒結結構-充填量比較	42
4-5不同燒結厚度毛細結構之蒸發熱阻比較	44
4-6 可視化觀察分析結果	46
4-6-1 池沸騰	46
4-6-2 薄膜沸騰	48
第五章 總結與建議	50
5-1 總結	50
5-2 未來建議	51
參考文獻	52
附錄1 誤差分析	54

圖目錄
圖1-1	熱管的構造與作動原理.........................................................3
圖1-2	可視化熱管實驗架構圖.........................................................5
圖1-3	蒸發熱阻與熱通量之關係圖.................................................5
圖1-4	大氣壓力下之可視化平板式熱管實驗架構圖.......................8
圖1-5	毛細表面加熱前與燒乾現象..................................................8
圖1-6	輸入瓦數與毛細熱阻值關係.................................................9
圖2-1	平板式熱管的構造與作動原理圖...........................................11
圖2-2	基本沸騰模式............................................................................18
圖2-3	過熱表面成核過程..................................................................19
圖2-4	池沸騰區域加熱面的蒸汽結構...............................................20
圖2-5	各種不同增強沸騰表面...........................................................21
圖2-6	半月液膜示意圖...........................................................22
圖3-1	燒結石墨磨具(上)與銅粉燒結試片(下)...................................24
圖3-2	無燒結毛細結構之底板(左)與燒結毛細結構之底板(右).......24
圖3-3	可視化平板式熱管之設計圖..............................................25
圖3-4	可視化平板式熱管實體視圖與剖面視圖........................26
圖3-5	水冷系統設計圖.............................................................27
圖3-6	實驗流程圖...............................................................28
圖3-7	實驗架構圖..........................................................29
圖3-8	溫度擷取器、高速攝影機、加熱平台與恆溫水…...................30
圖3-9	真空幫浦....................................................................................32
圖3-10	真空計......................................................................................32
圖3-11	實驗實體架設圖........................................................................33
圖3-12	熱電偶配置圖......................................................................34
圖3-13	加熱平台示意圖......................................................................35
圖4-1	填充率10% 輸入功率30W(無毛細結構)................................37
圖4-2	填充率20% 輸入功率30W(無毛細結構)................................37
圖4-3	填充率30% 輸入功率30W(無毛細結構)................................37
圖4-4	填充率50% 輸入功率30W(無毛細結構)................................38
圖4-5	填充率5% 輸入功率60W(燒結厚度0.4mm).......................38
圖4-6	填充率10% 輸入功率60W(燒結厚度0.4mm).......................39
圖4-7	填充率20% 輸入功率60W(燒結厚度0.4mm).......................39
圖4-8	填充率30% 輸入功率60W(燒結厚度0.4mm).......................39
圖4-9	溫度與蒸發熱阻之趨勢圖(燒結厚度0.4mm、填充率5%)…..40
圖4-10	填充率5% 輸入功率60W(燒結厚度0.7mm).......................40
圖4-11	填充率10% 輸入功率60W(燒結厚度0.7mm).......................41
圖4-12	填充率20% 輸入功率60W(燒結厚度0.7mm).......................41
圖4-13	填充率30% 輸入功率60W(燒結厚度0.7mm).......................41
圖4-14	溫度與蒸發熱阻之趨勢圖(燒結厚度0.7mm、填充率10%)....42
圖4-15	填充率5% 輸入功率60W(燒結厚度1.0mm).......................42
圖4-16	填充率10% 輸入功率60W(燒結厚度1.0mm).......................43
圖4-17	填充率15% 輸入功率60W(燒結厚度1.0mm).......................43
圖4-18	填充率20% 輸入功率60W(燒結厚度1.0mm).......................43
圖4-19	填充率30% 輸入功率60W(燒結厚度1.0mm).......................44
圖4-20	溫度與蒸發熱阻之趨勢圖(燒結厚度1.0mm、填充率15%)....44
圖4-21	各種燒結厚度之最佳熱阻與熱通量關係圖............................45
圖4-22	池沸騰時氣泡生成與破裂之現象............................................47
圖4-23	池沸騰時氣泡相容與破裂之現象............................................48
圖4-24	薄膜沸騰之液面上升與蒸發汽化現象............................49
表目錄
表1-1	三種不同尺寸的燒結銅粉.................................................9
表2-1	各種工作流體與流體作動溫度................................................16
表3-1	銅粉燒結參數表........................................................................23
表4-1	三種燒結厚度與各種填充率之沸騰情形................................46

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