本研究使用燒結法製備多孔性碳化矽薄膜應用於薄膜乳化，探討不同比例之黏著劑、助燒結劑對於薄膜性質之影響，用來控制薄膜的孔徑，並探討不同操作條件下對於薄膜乳化之成果。
實驗使用單軸壓錠成型與高溫爐進行燒結成膜，分析不同製膜條件對於薄膜微結構、膜機械強度、孔洞尺寸分布、孔隙度與晶相成份之影響。在薄膜乳化實驗部分，經由分析液滴尺寸、Span Value與分散相通量，探討不同製膜條件與操作條件對薄膜乳化成果之影響。最後進行薄膜清洗確認薄膜重複利用的可能性。
研究結果顯示，當黏著劑添加量變多，造成Span Value下降17.3%，但會使孔隙率下降。當助燒結劑添加量變多，造成薄膜提升30.7%的機械強度且縮小20.6%的乳化液滴尺寸，但會使孔隙率下降。操作條件在透膜壓差80 kPa，使用SDS當作界面活性劑時，能夠有最佳乳化結果。而使用0.2 wt%的Derquim LM 03清潔劑水溶液以300kPa逆洗後，回復率高達近90%，是有效的清潔方法。

In this study, SiC-base inorganic membranes were fabricated via uniaxial pressing, followed by sintering at 1350℃. The effects of adhesive, sintering aid and pore former additions on the membrane properties were thoroughly investigated. Accordingly, membrane pore size was controlled through adjusting additive amounts. The membranes were further evaluated with regards to their structural properties, pore characteristics and cleaning was used to confirm the possibility of reusing in the membrane emulsification.
The results show that with the increase of adhesive additive amounts, Span value increased by 17.3%, while its porosity decreased. Additionally, membrane mechanical strength was enhanced by 30.7% under higher sintering aid concentrations, accompanied by the reduction of membrane porosity and oil droplet size by 20.6%. In this study, the optimum emulsification performance was obtained under the transmembrane pressure of 80 kPa with the use of SDS as a surfactant. High flux recovery rate of 90% was obtained after backwash cleaning with 0.2 wt% of Derquim LM 03 aqueous solution, verifying the effectiveness of this cleaning method.

中文摘要	I
英文摘要	II
目錄	III
圖目錄	VI
表目錄	VIII
第一章 緒論	1
1-1 前言	1
1-2 薄膜乳化背景	4
1-3 薄膜乳化的近期應用	7
1-4 應用於薄膜乳化的薄膜材料	9
1-5 研究動機與目的	11
第二章 文獻回顧	12
2-1 無機薄膜的製備	13
2-2 多孔碳化矽薄膜製備	15
2-3 黏著劑與助燒結劑的選用	17
2-4 薄膜乳化的操作模式	21
2-5 影響乳化液滴尺寸的操作參數	23
2-6 薄膜清潔效率	27
第三章  實驗材料、裝置與方法	28
3-1	碳化矽薄膜製備	28
3-1-1	實驗藥品	28
3-1-2	實驗設備	29
3-1-3	薄膜燒結程序	31
3-1-4	薄膜製備程序	31
3-1-5	薄膜編號	33
3-1-6	薄膜性質檢測	33
3-2	薄膜乳化實驗	37
3-2-1	實驗藥品	37
3-2-2	實驗裝置	39
3-2-3	實驗方法	40
3-2-4	檢測儀器與分析方法	41
3-3	薄膜清洗實驗	44
3-3-1	實驗藥品、儀器	44
3-3-2	實驗裝置	44
3-3-3	實驗方法	45
第四章  結果與討論	46
4-1	改變黏著劑添加量對於薄膜乳化之結果探討	47
4-1-1	薄膜結構分析	47
4-1-2	薄膜孔隙分析	52
4-1-3	薄膜晶相分析	55
4-1-4	薄膜機械強度分析	57
4-1-5	薄膜乳化結果探討	59
4-2	改變助燒結劑添加量對於薄膜乳化之結果探討	61
4-2-1	薄膜結構分析	61
4-2-2	薄膜孔隙分析	65
4-2-3	薄膜晶相與機械強度分析	67
4-2-4	薄膜乳化結果探討	70
4-3	改變基材助燒結劑添加量對於薄膜乳化之結果探討	72
4-3-1	薄膜結構分析	72
4-3-2	薄膜孔隙與機械強度分析	73
4-3-3	薄膜乳化結果探討	75
4-4	改變透膜壓差對於薄膜乳化之結果探討	77
4-5	改變界面活性劑濃度對於薄膜乳化之結果探討	80
4-6	改變不同界面活性劑種類對於薄膜乳化之結果探討	84
4-7	薄膜清洗與通量回復	86
第六章 結論	89
參考文獻	92


 
圖目錄
Fig. 1-1 預混膜乳化和錯流膜乳化示意圖[4]	3
Fig. 1-3 薄膜乳化的發展階段	5
Fig. 1-4 薄膜乳化過程示意圖	5
Fig. 1-5 影響薄膜乳化之參數	6
Fig. 1-6 薄膜乳化之應用領域	7
Fig. 2-1 直接薄膜乳化(A)與預混合薄膜乳化(B)	22
Fig. 2-2 動態薄膜乳化模式(A)與靜態薄膜乳化模式(B)	22
Fig. 2-3 不同種清潔條件水通量之回復率[58]	27
Fig. 3-1 薄膜燒結溫度曲線	31
Fig. 3-2 三點負荷示作用示意圖	35
Fig. 3-3 薄膜乳化實驗裝置示意圖	39
Fig. 3-4 薄膜清洗實驗裝置示意圖	44
Fig. 4-1 碳化矽薄膜示意圖	46
Fig. 4-2 破裂薄膜示意圖	47
Fig. 4-3 不同黏著劑添加量其表面放大1000倍之SEM圖	49
Fig. 4-4 不同黏著劑添加量其下表面放大1000倍之SEM圖	51
Fig. 4-5 不同黏著劑添加量其橫截面SEM圖	51
Fig. 4-6 不同黏著劑添加量對於薄膜孔隙率度	54
Fig. 4-7 不同黏著劑添加量與薄膜燒結前後密度比較	54
Fig. 4-8 不同黏著劑添加量與X光繞射分析圖譜	56
Fig. 4-9 不同黏著劑添加量之機械強度比較	58
Fig. 4-10 不同黏著劑添加量對於乳化液滴尺寸與Span Value	60
Fig. 4-11 不同黏著劑添加量對於分散相通量	60
Fig. 4-12 不同助燒結劑添加量表面放大1000倍之SEM影像	62
Fig. 4-13 不同助燒結劑添加量之下表面放大1000倍SEM影像	63
Fig. 4-14 不同助燒結劑添加量之橫截面放大300倍SEM影像	64
Fig, 4-15 不同助燒結劑添加量對於薄膜孔隙度	66
Fig. 4-16 不同助燒結劑添加量與薄膜燒結前後密度比較	66
Fig, 4-17 不同助燒結劑添加量與X光繞射分析圖譜	68
Fig. 4-18 不同助燒結劑添加量之機械強度比較	69
Fig. 4-19 不同助燒結劑添加量對於乳化液滴尺寸與Span Value	71
Fig. 4-20 不同助燒結劑添加量對於分散相通量	71
Fig. 4-21 基材不同高嶺土添加量表面1000倍SEM圖	72
Fig. 4-22 不同基材高嶺土添加量之薄膜孔隙度比較	74
Fig. 4-23 不同基材高嶺土添加量之機械強度比較	74
Fig. 4-24 不同基材高嶺土添加量對於乳化液滴尺寸與Span Value	76
Fig. 4-25 不同基材高嶺土添加量對於分散相通量	76
Fig. 4-26 改變透膜壓差對於薄膜乳化之影響	79
Fig. 4-27 改變界面活性劑濃度對於薄膜乳化之影響	82
Fig. 4-28 高濃度界面活性劑在不同透膜壓差之液滴尺寸變化	82
Fig. 4-29 高濃度界面活性劑在不同透膜壓差之Span值變化	83
Fig. 4-30 改變不同界面活性劑種類對於薄膜乳化之影響	85
Fig. 4-31 薄膜乳化實驗前(A)後(B)表面放大1000倍影像	87
Fig. 4-32 重複乳化對於薄膜乳化之結果	88


 
表目錄
Table 2-1常見的基材及其物化性質[39]	20
Table 2-2常使用的黏著劑[39]	20
Table 3-1 碳化矽薄膜配方組成	33
Table 3-2 大豆油相特性分析	37
Table 4-1 不同黏著劑添加量之孔徑大小	51
Table 4-2 薄膜厚度表(M01, M02, M03)	58
Table 4-3 不同助燒結劑添加量之孔徑大小	64
Table 4-4薄膜厚度表(M4, M05, M06)	69
Table 4-5 薄膜厚度及孔徑表(M06, M07, M08)	73
Table 4-6 不同界面活性劑其表面張力	85

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