本論文系將聚丙烯、黏土、碳黑利用熔融混煉法製備成PP/clay/cb之導電奈米複材。以表面電阻儀量測各複材的表面電阻係數；SEM觀察碳黑與黏土在高分子基材中的分散情形與複材的相形態；XRD確定黏土的剝、插層情形。
    TGA測定各複合材料的熱裂解溫度(Td)；DSC量測複材的熔點(Tm)與結晶度的變化；DMA測定複材的固態機械性質；平板式流變儀測定複材的熔融態流變性質。結果發現PP/clay/cb複材中，經加工條件的確定，與各成份間的適當比例，可以少量的clay添加，使表面電阻大幅下降，且經由適當的相容劑的選擇與添加量，可提升複材的機械性質。並藉由各種測試的結果，探討其之間的相互關係以及對複材物性之影響。

In this study, we aimed at blending polypropylene(PP)/clay and carbon black(cb) by melt mixing to manufacture conductive polymer nanocomposites. We used the surface resistance meter to measured surface resistivity；scanning electron microscopy(SEM) to investigate the morphology of the nanocomposites and the dispersion of clay and carbon black in the polymer matrix；XRD to analyze the exfoliation or intercalation of clay；plate-plate rheometer to measure the  rheological properties .
   Thermal degradation behavior and dynamics mechanical properties of  nanocomposites were analyzed by thermal gravimetric analysis(TGA) and dynamics mechanical analysis(DMA), the degree of crystallization and melt temperature(Tm) of the blends were observed by differential scanning calorimetry(DSC). The results indicated in PP/clay/cb composites, we may sharply lower the surface resistivity by adding only 2phr clay under the terms of appropriate processing condition and formula. We can also improve the mechanical properties of nanocomposites by selection of compatibilizer and the amount of adding.    
   Then we’ll discuss and analyze all the results and find out the relationship between all the tests.

中文摘要                                                 Ⅰ
英文摘要                                                 Ⅱ
總目錄                                                   IV
圖目錄                                                 VIII
表目錄                                                  XII

第一章 緒論……………………………………………………………1
1-1前言……………………………………………………1
1-2研究動機與目的………………………………………………3
第二章 文獻解析………………………………………………………6
2-1導電高分子……………………………………………………6
   2-1-1導電高分子源起……………………………………………6
   2-1-2 導電高分子種類……………………………………………6
   2-1-3 滲透門檻……………………………………………………10
   2-1-4 碳黑簡介……………………………………………………12
   2-1-5 碳黑製造之方法……………………………………………15
   2-1-6 導電高分子複合材料………………………………………17
   2-1-7 導電性的評估………………………………………………20
2-2有機黏土複合材料…………………………………………………20
2-2-1蒙脫土簡介………………………………………………………20
2-2-2高分子混摻黏土之複合材料分散型態…………………………22
2-2-3 蒙脫土改質………………………………………………23
2-2-4  高分子奈米複合材料之製備……………………………26
2-2-5聚丙烯有機改質土複合材料……………………………………28
2-3碳黑改質土複合材料………………………………………………30
第三章 理論基礎
3-1靜電防護與電磁波遮蔽……………………………………………32
3-2 電磁波干擾與遮蔽 ………………………………………………34
3-3 流變學原理 ………………………………………………………40
3-3-1 流變學研究內容與意義 ………………………………………41
3-3-2摻合體之流變行為………………………………………………43
3-3-3 剪切黏度 ………………………………………………………44
3-3-4動態流變行為……………………………………………………46
3-3-5線性黏彈性質……………………………………………………47
3-6  x-射線繞射與Bragg 定律………………………………………48
第四章 實驗……………………………………………………………51
4-1實驗材料……………………………………………………………51
4-2實驗儀器……………………………………………………………53
4-3實驗方法……………………………………………………………56
4-3-1 聚丙烯/碳黑/25A黏土 奈米複合材料的製備 ………………56
4-3-2 聚丙烯/碳黑/I30P黏土 奈米複合材料的製備………………58
4-3-3 聚丙烯/碳黑/I30P黏土 奈米複合材料的solvent-treated製 
      備法 ……………………………………………………………60
4-4 材料測試與分析 …………………………………………………62
4-5 樣品分析流程 ……………………………………………………66
第五章 結果與討論……………………………………………………67
5-1表面電阻分析………………………………………………………67
5-1-1塑譜儀轉速對導電複材之表面電阻的影響……………………67
5-1-2 基材黏度對導電複材表面電阻的影響 ………………………68
5-1-3 有機黏土在導電複材中的添加 ………………………………70
5-1-4 有機黏土的插層與剝層對複材表面電阻的影響 ……………74
5-2 SEM微觀相形態……………………………………………………87
5-3 DSC熱分析探討……………………………………………………97
5-4流變行為分析…………………………………………………….103
5-4-1動態流變性質 …………………………………………………103
5-4-2頻率掃描………………………………………………………107
5-4-3 複合剪切黏度(Complex shear viscosity)…………………111
5-5 DMA動態機械性質分析…………………………………………113
5-6 TGA熱重損失分析………………………………………………116
5-7 經熱處理後的表面電阻……………………………………….117
第六章 結論 ………………………………………………………122
第七章 參考文獻……………………………………………………123
圖目錄
圖2-1導電性高分子的分類……………………………………………8
圖2-2導電填充物之含量與阻抗之滲透曲線...................11
圖2-3碳黑的生成過程…………………………………………………13
圖2-4 碳黑的高、低階結構…………………………………………14
圖2-5 矽酸鹽層結構示意圖 …………………………………………21
圖2-6  高分子/黏土複合材料之混成結構 …………………………22
圖2-7 高分子藉由剪切力呈現剝離型態 ……………………………30
圖3-1 靜電產生示意圖………………………………………………33
圖3-2 晶格繞射結構圖………………………………………………48
圖4-1 聚丙烯/碳黑/25A黏土 奈米複合材料的製備流程圖………57
圖4-2 聚丙烯/碳黑/I30P黏土 奈米複合材料的製備流程圖………59
圖4-3 PP/cb/I30P黏土 奈米複合材料的溶劑處理製備流程圖……61
圖4-4 碳黑/黏土導電複材樣品分析流程……………………………66
圖5-1  180℃加工時PP+cb的表面電阻 ……………………………70
圖5-2(a)  配方A 之XRD繞射圖……………………………………77
圖5-2(b)  配方B之XRD繞射圖……………………………………77
圖5-3    配方C 之XRD繞射圖……………………………………81
圖5-4   配方D 之XRD繞射圖……………………………………81
圖5-5  PP + cb8phr + I30P 2phr(經甲苯處理)的XRD結果………86
圖5-6  配方C1的SEM淬斷面圖……………………………………89
圖5-7  配方D1的SEM淬斷面圖……………………………………89
圖5-8  配方C2的SEM淬斷面圖……………………………………90
圖5-9  配方D2的SEM淬斷面圖……………………………………90
圖5-10  配方C3的SEM淬斷面圖……………………………………91
圖5-11  配方D3的SEM淬斷面圖……………………………………91
圖5-12  配方C4的SEM淬斷面圖……………………………………92
圖5-13  配方D4的SEM淬斷面圖……………………………………92
圖5-14  配方C1的SEM表面圖………………………………………93
圖5-15  配方C2的SEM表面圖………………………………………93
圖5-16  配方C3的SEM表面圖………………………………………94
圖5-17  配方C4的SEM表面圖………………………………………94
圖5-18  配方D1的SEM表面圖………………………………………95
圖5-19  配方D2的SEM表面圖………………………………………95
圖5-20  配方D3的SEM表面圖………………………………………96
圖5-21  配方D4的SEM表面圖………………………………………96
圖5-22  PP添加不同含量cb之DSC圖…………………………………97
圖 5-23  配方C系列的DSC升溫曲線………………………………99
圖 5-24  配方C系列的DSC降溫曲線………………………………99
圖 5-25  配方D系列的DSC升溫曲線……………………………101
圖 5-26  配方D系列的DSC降溫曲線……………………………101
圖 5-27  配方C系列的振幅掃描結果與PP+cb的比較圖…………105
圖 5-28  配方C系列的振幅掃描結果與PP+I30P的比較圖………105
圖 5-29  配方D系列的振幅掃描結果與PP+cb的比較圖…………106
圖 5-30  配方D系列的振幅掃描結果與PP+I30P的比較圖………106
圖 5-31  配方C系列的頻率掃描結果與PP+cb的比較圖 ………109
圖 5-32  配方C系列的頻率掃描結果與PP+I30P的比較圖 ……109
圖 5-33  配方D系列的頻率掃描結果與PP+cb的比較圖………110
圖 5-34  配方D系列的頻率掃描結果與PP+I30P的比較圖 ……110
圖 5-35  配方C系列的複合剪切黏度圖……………………………112
圖 5-36  配方D系列的複合剪切黏度圖 …………………………112
圖 5-37  配方C系列的DMA分析圖 ………………………………114
圖 5-38  配方D系列的DMA分析圖 ………………………………114
圖5-39  配方D系列的TGA分析圖………………………………115
圖5-40  D2經annealed前後的DSC結果…………………………118
圖5-41  D3經annealed前後的DSC結果…………………………119
圖5-42  D4經annealed前後的DSC結果…………………………119
圖5-43  PP+cb8phr經annealed前後的DSC結果…………………120
圖5-44  PP+cb15phr經annealed前後的DSC結果………………121

表目錄
表1-1雜訊產生源的範例 ………………………………………………2
表1-2 十大電腦機殼所採用的防電磁波干擾方法……………………3
表2-1 各種導電填充料…………………………………………………9
表2-2 碳黑的製造法………………………………………………16
表2-3 一般高分子材料的表面電阻係數與體積電阻係數…………17
表3-1各類材料之表面電阻係數………………………………………40
表5-1 加工轉速對表面電阻的影響 …………………………………67
表5-2  PP添加不同比例之碳黑其表面電阻結果(a) ………………68
表5-2  PP添加不同比例之碳黑其表面電阻結果(b) ………………69
表5-3(a)  25A與I30P體積相等時的添加量對照表 ………………71
表5-3(b)  添加不同比例25A後的碳黑導電複材表面電阻 ………72
表5-3(c)  添加不同比例I30P後的碳黑導電複材表面電阻………73
表5-4 (a)  樣品配方A及XRD測試後結果…………………………75
表5-4 (b)  樣品配方B及XRD測試後結果…………………………76
表5-4 (c)  樣品配方C及XRD測試後結果…………………………79
表5-4 (d)  樣品配方D及XRD測試後結果…………………………80
表5-5 配方A、B、C、D經兩段式加工添加8phr碳黑後的
      表面電阻 ………………………………………………………83
表5-6  PP添加不同含量的cb後的熔點、吸熱焓、結晶度…………98
表5-7  配方C系列的熔點、結晶溫度、吸熱焓、結晶度…………100
表5-8  配方D系列的熔點、結晶溫度、吸熱焓、結晶度…………102
表5-9 配方D系列的熱烈解溫度表…………………………………116
表5-10 D系列的熔點、吸熱焓及表面電阻的比較…………………120
表5-11  PP添加不同含量cb的熔點、吸熱焓及表面電阻的比較 …121

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