微透鏡陣列（MLA）已廣泛用於圖像系統、照明系統及光收集裝置，如光場相機、LED照明中的二次光學器件、太陽能集中器…等。迄今為止，塑膠微透鏡陣列以及在玻璃基板上轉印塑膠微透鏡陣列仍是光學及光電行業的主要選擇，主要因塑膠具有出色的成形性、重量輕及低成本等優勢。然而，當塑膠鏡片受紫外線照射時具有老化和降解的缺點，且與玻璃相比塑膠相對具有較低的工作溫度和折射率（nd）值。儘管玻璃具有如此多的先進性能，然而玻璃模造製程中的高成型溫度和應力卻使得製造精密玻璃微透鏡陣列非常具有挑戰性，特別是當所需的矢高量變大、形狀更加複雜（例如雙凸/凹凸透鏡或有多個不同的尺寸及形狀在一個微透鏡陣列中）。本研究旨在開發一種製造精密玻璃微陣列透鏡的新方法，並解決模造複雜形狀微透鏡陣列的問題。除了傳統的玻璃板材成形法外，本研究提出了孔板模造和孔板成形法，並在此研究中進行了相關的模擬和實驗。最終採用孔板模造法成功生成了透鏡矢高量在50μm~150μm之間，表面粗糙度優於10nm（Ra），形狀精度優於0.02μm（P-V）的雙凸玻璃微透鏡陣列。基於模擬顯示，與玻璃板材成形法相比，孔板模造法中涉及的成形應力要低得多。如要使用孔板模造法製作曲面微陣列透鏡，則容易使透鏡出現溢料和填充不完全的情形。研究中提出孔板成形法能夠解決上述問題，並為在曲面上製造精密玻璃微透鏡陣列提供一種可行的方法。

Micro-lens array (MLA) has been widely used in image systems, e.g. light field camera, lighting system, e.g. secondary optics in LED illumination, and light collecting devices, e.g. solar concentrator. Up to this day, plastic MLAs and polymer on glass MLAs are still the main choices in the optical and opto-electronic industry for its superb formability, lightweight, and low cost. However, plastics do have the setback of aging and degradation when subject to ultra-violet exposure and, in general, it has relatively lower working temperature and refraction index (nd) value in comparison to glass. Though has so many advanced properties, high forming temperature and stress involved in glass molding processes have made fabricating precision glass MLAs a very challenging one especially when the required sag gets bigger, shape gets more complicated (such as bi-convex/meniscus lens or several sizes/shapes in one MLA). This study aims to develop a novel way to fabricate precision glass MLAs and to tackle the problem in molding MLAs with complicated shape. Apart from conventional glass plate forming method, hole-plated mold and hole-plate forming methods are proposed and the related simulations together with experiments are conducted in this research. Bi-convex glass MLAs with lens sag between 50μm to 150μm, surface roughness better than 10 nm (Ra) and form accuracy better than 0.02μm (P-V) were successfully generated by using hole-plate mold method. In comparison to glass plate forming method, the forming stress involved in hole-plate mold method is much lower. Based on the simulation, flash and incomplete filling will appear on most of the obtained lenses if hole-plate mold method is to be applied to produce MLAs on a curved surface. The hole-plate forming method is found in the study to be able to resolve the above mentioned problem and offer a feasible way to fabricated precision glass MLAs on a curved surface.

圖目錄	I
表目錄	VII
第一章 緒論	1
第二章 基礎理論及文獻回顧	8
2-1光學玻璃材料	8
2-1-1玻璃材料的組成	8
2-1-2玻璃的性質	9
2-1-3玻璃毛胚製作	16
2-1-4玻璃預形體	17
2-2模造模仁之設計與製作	19
2-2-1材料選擇	19
2-2-2模具加工	24
2-2-3磨料噴射加工	39
2-2-4模造模仁表面之抗沾黏鍍層	43
2-3玻璃模造製程	48
2-3-1 模造製程介紹	48
2-3-2 有限元素模擬	51
2-4轉印製程	57
2-4-1 轉印技術	57
2-4-2 轉印材料	59
第三章 研究方法與步驟	64
3-1研究規劃	64
3-2研究設備	68
3-3方法與步驟	76
第四章 模造製程	80
4-1模具設計	80
4-1-1平面型透鏡陣列模具設計	80
4-1-2曲面型透鏡陣列模具設計	86
4-2平面型微透鏡陣列	89
4-2-1 平面型微透鏡陣列模造模擬	89
4-2-2 模仁與玻璃孔板製作	102
4-2-3 高溫模造平面微透鏡陣列	124
4-3曲面型微透鏡陣列	136
4-3-1角度傾斜對於模造透鏡之影響	136
4-3-2模仁與曲面玻璃基板製作	147
4-3-3低溫模造曲面微透鏡陣列	162
第五章 結論	167
參考文獻	169
附錄	181
圖目錄
圖1- 1 各類微透鏡陣列	1
圖1- 2 傳統數位相機	2
圖1- 3 光場相機【9】	3
圖1- 4 微陣列透鏡	3
圖2- 1折射示意圖【26】	10
圖2- 2 SCHOTT公司光學玻璃之分類【27】	12
圖2- 3玻璃材料L-BAL42溫度-體積曲線圖【32】	15
圖2- 4玻璃預形體示意圖	18
圖2- 5 模仁製作流程【44】	25
圖2- 6 超精密加工製程分類 【53】	26
圖2- 7 磨削機制【57】	29
圖2- 8 碳鋼上形成Ni-P鍍層之機制【66】	35
圖2- 9無電鍍與電鍍之鍍層均勻性比較【69】	37
圖2- 10 熱處理1小時後磷含量對硬度的影響【69】	38
圖2- 11 磨粒衝擊的侵蝕機制【75】	39
圖2- 12 脆性材料侵蝕移除機制	40
圖2- 13具有遮罩的磨料噴射加工	40
圖2- 14 光阻遮罩製作流程【73】	41
圖2- 15 不同材料與磨料加工的材料移除率【81】	43
圖2- 16為擴散阻隔層示意圖	46
圖2- 17模造加壓示意圖【32】(a)加熱(b)加壓(c)退火(d)冷卻	48
圖2- 18 雙面微陣列透鏡【89】	50
圖2- 19為FEM應力分布圖【93】	52
圖2- 20模擬集光效率【94】	53
圖2- 21碳化鎢材料模擬持溫(a)120秒(b)180秒(c)220秒【32】	53
圖2- 22潛變及應力鬆弛模型【97】	55
圖2- 23透鏡的設計與模擬【99】	56
圖2- 24奈米壓印光刻技術示意圖	57
圖2- 25熱壓印【100】和紫外光壓印技術【109】之比較。	59
圖2- 26 轉印圖案的SEM照片	61
圖2- 27 一維和二維有序圖案的製造過程示意圖【120】	63
圖3- 1 板材加壓法模壓陣列透鏡(模壓玻璃板材)	64
圖3- 2 孔板模造法模壓陣列透鏡(孔板+玻璃預形體)	65
圖3- 3轉印曲面微陣列透鏡示意圖	66
圖3- 4 實驗規劃	67
圖3- 5 超精密加工機 ULG(HYB-100D)	69
圖3- 6 超精密加工機 ULG(HYB-100D) 各軸示意圖	69
圖3- 7 MB-20V磨料噴射加工機	71
圖3- 8 Keyence 雷射共軛焦顯微鏡(VK-9700)	72
圖3- 9盟立GP-0165玻璃模造機	73
圖3- 10 SU-8 GM1075負光阻膠	74
圖3- 11 高溫-碳化鎢-模造製程之規劃	76
圖3- 12 低溫-無電解鎳-轉印製程之規劃	77
圖3- 13 模具設計與加工流程圖	79
圖4- 1光學模擬-平面微透鏡陣列之焦距與光通量模擬結果	81
圖4- 2光學模擬-平面微透鏡陣列之MTF模擬結果	82
圖4- 3模具圖	85
圖4- 4光學模擬-曲面微透鏡陣列之焦距與光通量模擬結果	87
圖4- 5模具圖	88
圖4- 6溫度之模擬規劃	89
圖4- 7溫度改變對於壓力之影響	90
圖4-8 速率之模擬規劃	91
圖4- 9加壓速率改變對於壓力之影響	92
圖4- 10矢高量模擬規劃	93
圖4- 11模擬平凸透鏡於不同矢高量之影響圖	95
圖4- 12模具形式之模擬規劃	96
圖4- 13 透鏡形式模擬圖	96
圖4- 14單顆透鏡模擬結果	97
圖4- 15 2*2陣列透鏡模擬結果	98
圖4- 16 3*3陣列透鏡模擬結果	98
圖4- 17孔板模造法-各類透鏡之加壓壓力比較	100
圖4- 18板材加壓法-各類透鏡之加壓壓力比較	101
圖4- 19磨料噴射加工示意圖(未使用遮罩)	102
圖4- 20噴嘴與工件距離對於孔輪廓之影響	103
圖4- 21噴嘴與工件距離與入口端直徑之關係圖	104
圖4- 22 噴砂壓力與侵蝕深度之關係圖	105
圖4- 23 噴嘴距離對於侵蝕深度與材料移除體積之影響	106
圖4- 24磨料噴射加工示意圖(使用遮罩)	107
圖4- 25掃描速率對孔洞側壁錐度之影響	108
圖4- 26磨料噴射加工圓孔之入口端與出口端尺寸圖	109
圖4- 27 掃描160次之圓孔結果OM圖	109
圖4- 28 不同間距之圓孔加工結果趨勢圖	110
圖4- 29不同間距之圓孔加工結果圖	110
圖4- 30 掃描次數對於間距誤差百分比之影響	111
圖4- 31孔板遮罩圖	112
圖4- 32玻璃孔板成品圖	113
圖4- 33 sag50之雙面噴砂定位圖	113
圖4- 34 sag50孔徑平均值	115
圖4- 35 sag150孔徑平均值	116
圖4- 36 double孔徑平均值	117
圖4- 37孔板-內壁情況	117
圖4- 38孔板-側壁錐度	118
圖4- 39校正示意圖	120
圖4- 40模具加工流程	120
圖4- 41 加工完成之模仁	122
圖4- 42 陣列透鏡模仁量測順序	122
圖4- 43 sag50-陣列透鏡模仁量測-PV-Ra結果圖	123
圖4- 44 sag150-陣列透鏡模仁量測-PV-Ra結果圖	123
圖4- 45陣列透鏡成品圖	124
圖4- 46材料流動圖	125
圖4- 47通孔成形偏心圖	125
圖4- 48曲率截斷範圍示意圖	126
圖4- 49透鏡之曲率正負截斷範圍	127
圖4- 50板材加壓法-實驗與模擬比對	127
圖4- 51板材加壓法-實驗與模擬疊合圖	127
圖4- 52孔板模造法-雙凸透鏡陣列成品圖	128
圖4- 53孔板模造法-雙凸透鏡陣列成品剖面圖	129
圖4- 54成品拼接量測圖	129
圖4- 55雙凸陣列透鏡-Sag50面之表面粗糙度及形狀精度圖	131
圖4- 56雙凸陣列透鏡-Sag150面之表面粗糙度及形狀精度圖	131
圖4- 57孔板模造法-雙凸陣列透鏡(sag50+150μm) MTF圖	135
圖4- 58 角度傾斜規劃圖	136
圖4- 59孔板模造法-角度傾斜模擬結果	139
圖4- 60板材加壓法-角度傾斜模擬結果	140
圖4- 61 凹凸透鏡模壓材料流動情況(傾斜角度45°)	141
圖4- 62 孔板成形法	142
圖4- 63 (a)孔板成形法-加壓孔板配置圖	143
圖4- 64 模擬傾斜角度時-成形壓力示意圖	145
圖4- 65孔板成形法-成形透鏡圖	145
圖4- 66孔板成形法於傾斜角度成形之模擬結果	146
圖4- 67熱處理後之表面形貌-直接升溫	149
圖4- 68熱處理溫度對於表面粗糙度之影響(Sa/Sq/Sz)	150
圖4- 69熱處理後之硬度比較圖(300-600°C)	151
圖4- 70無電解鎳熱處理溫度300°C之XRD圖	152
圖4- 71無電解鎳熱處理溫度500°C之XRD圖	152
圖4- 72 無電解鎳熱處理溫度600°C之XRD圖	153
圖4- 73 升溫速率0.04℃/s直接升溫至600℃熱處理之表面情況	153
圖4- 74分段升溫與直接升溫之表面粗糙度比較	155
圖4- 75無電解鎳模仁量測圖	156
圖4- 76熱坍塌實驗	161
圖4- 77熱坍塌之玻璃圓板	162
圖4- 78熱坍塌的玻璃圓板R值量測結果	162
圖4- 79光學矽膠-曲面微透鏡陣列	163
圖4- 80光學矽膠-sag20/30/50曲面微透鏡陣列量測結果	164
圖4- 81光學矽膠-sag50曲面微透鏡陣列量測結果	165
圖4- 82光學矽膠-sag150曲面微透鏡陣列量測結果	165
 
表目錄
表2- 1 玻璃材料缺陷	16
表2- 2 加工法選擇參考【44】	25
表2- 3 不同磨料的特性差異	27
表2- 4 無電解鎳之特性及優勢概述【63、64】	32
表2- 5 不同磷含量之鍍層性能【66】	36
表2- 6玻璃模造模仁之鍍層比較【86】	46
表3- 1超精密加工機ULG(HYB-100D)之規格表	69
表3- 2 Keyence 雷射共軛焦顯微鏡VK-9700規格表	72
表3- 3盟立GP-0165玻璃模造機之規格表	73
表3- 4 Dow Corning® OE-6662規格表	75
表4- 1 MTF模擬結果	82
表4- 2模具參數	83
表4-3溫度改變對於壓力之影響(單位：N/mm2)	90
表4-4速度改變對於壓力之影響(單位：N/mm2)	91
表4- 5模擬之設置	93
表4- 6矢高與壓力之模擬結果(N/mm2)	94
表4- 7各類透鏡模擬壓力比較表	99
表4- 8噴砂加工之基礎實驗參數	103
表4- 9 微影製程參數	107
表4- 10 孔板加工參數	112
表4- 11 孔板-sag50孔徑平均值	114
表4- 12 孔板-sag150孔徑平均值	115
表4- 13 孔板-double孔徑平均值	116
表4- 14 孔徑側壁錐度及側壁高度平均值	118
表4- 15陣列模具加工參數表	121
表4- 16陣列透鏡模仁量測結果	122
表4- 17 板材加壓法-陣列透鏡實驗參數表	124
表4- 18板材加壓法-模造陣列透鏡之曲率半徑量測結果	126
表4- 19實驗與模擬比對之曲率半徑表	127
表4- 20玻璃模造-微透鏡陣列實驗參數表	128
表4- 21 微陣列雙凸透鏡量測結果(um)	130
表4- 22 孔板模造法成形的透鏡陣列焦距	132
表4- 23 孔板模造法-雙凸陣列透鏡(sag50+150μm) MTF值	133
表4- 24 角度傾斜模擬參數表	137
表4- 25 孔板模造法-角度傾斜模擬結果	137
表4- 26 板材加壓法-角度傾斜模擬結果	138
表4- 27 孔板成形法模擬參數表	143
表4- 28孔板成形法之模擬結果	146
表4- 29熱處理實驗參數	148
表4- 30熱處理後之表面粗糙度	150
表4- 31Ni3P結晶尺寸(單位：A)	151
表4- 32 直接升溫-不同速率之表面粗糙度結果	153
表4- 33 分段升溫之實驗參數	154
表4- 34慢刀伺服加工參數及模具圖	156
表4- 35 sag 50模具量測結果	158
表4- 36 sag 50/150模具量測結果	159
表4- 37 sag 20/30/50模具量測結果	160
表4- 38熱坍塌實驗參數	161
表4- 39轉印參數	162
表4- 40透鏡轉印誤差百分比	164
表4- 41 曲面型陣列透鏡焦距量測結果(單位:mm)	166

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