近年來，行動通訊裝置迅速發展，電腦執行速度愈來愈快，處理器執行速度越來越快，而尺寸愈來愈小，為了將此密集熱量有效散發，以維持處理器於許可溫度之下運作，用以協助處理器散熱，來增加散熱能力。
舊型行動通訊裝置採空間自然散熱方式，並未於散熱多做加強，但高溫的空氣使得散熱效果大打折扣。
本論點提供一種主系統的散熱裝置，於主要晶片上貼合一散熱媒介裝置，使高溫不會滯留於晶片上，因此可達快速散熱作用，有效的增加處理器之散熱效率。
行動通訊裝置一般不會針對散熱考慮其中，故散熱效果較差，因空間限制、降低成本造成。在此利用主晶片、電源晶片上端至隔離罩間空間增加一散熱裝置，如銅片，達到主晶片增加散熱效果。相對可望降低裝置內主晶片溫度，優化系統增加主機效能，增加應用程式執行順暢度、3G網路、WIFI、速度….等。

In recent years, the rapid development of mobile devices, computer running more quickly speed, the processor executes at an increasing rate, size becoming smaller and smaller, in order to effectively distribute heat densely, maintain the temperature of the processor operating in permission, to assist in processor heat dissipation, increase heat dissipation.
Older cell phone space mining natural heat dissipation, do not strengthen in the heat dissipation, but the high temperature air cooling effect making the greatly reduced.
The master point to provide a heat dissipation device system, posted in major chip heat dissipation intermediary apparatus, high temperature dose not stay on the chip, rapid heat dissipation effect, effectively increase the heat dissipation efficiency of the processor.
Cell phone which is generally not considered for the heat dissipation, poorer heat dissipation effect, space limitations、caused by costs down. In this use main chip、power chip to cover the upper space to add a heat dissipation device, such as copper sheet, achieve main chip heat dissipation effect. Inside the device relative reduction temperature on main chip, optimization system performance increase on host, increase application is running and smooth、speed of 3G、WIFI.

目錄
誌謝	I
中文摘要	II
ABSTRACT	III
目錄	IV
圖目錄	VI
表目錄	VII
第一章 緒論	1
1.1 研究動機與目的	1
1.2 設計概念	1
第二章 行動通訊裝置機構元件組成概述	4
2.1 觸控面板	4
2.1.1 電阻式觸控面板	4
2.1.2 電容式觸控面板	5
2.1.3 電磁式觸控面板	5
2.2 前殼總成	6
2.3 液晶顯示螢幕	6
2.4 主機板	7
2.5 後殼總成	8
2.5.1 電池蓋	9
2.6 鋰電池	10
第三章 IC溫度良測與分析	11
3.1 模擬實驗介紹	11
3.2 系統模擬環境與步驟	12
3.2.1 建立測驗環境設備系統	13
3.3 測試流程說明	14
3.3.1 測試流程圖說明	15
3.4 裝置IC溫度量測	16
3.4.1 溫度良測表	17
3.5 裝置軟體測試	18
3.5.1 NenaMark1影像處理效能測試	18
3.5.2 安兔兔評測硬體效能測試	19
3.5.3 Quadrant Standard硬體效能測試	20
3.5.4 Smart bench CPU與GPU效能測試	22
3.5.5 Vellamo進行網路效能測試	23
3.5.6 評測APP軟體統計能測試	25
3.5.7 測試結果分析	26
第四章 結論與未來展望	27
參考文獻	29
 
圖目錄
圖 2.1 前殼總成	6
圖 2.2 液晶的基本特性	7
圖 2.3 行動通訊裝置主機板	7
圖 2.4 後殼總成	8
圖 2.5 電池蓋	9
圖 3.1 手機晶片散熱結構基本架構	11
圖 3.2 測驗環境架設	13
圖 3.3測試流程圖	15
圖 3.4裝置晶片溫度量測	16
圖 3.5 IC溫度量測表	17
圖 3.6實驗組NenaMark1測試結果	18
圖 3.7對照組NenaMark1測試結果	18
圖 3.8 實驗組安兔兔評測測試結果	19
圖 3.9對照組安兔兔評測測試結果	20
圖 3.10實驗組Quadrant Standard測試結果	21
圖 3.11對照組Quadrant Standard測試結果	21
圖 3.12實驗組Smart bench測試結果	22
圖 3.13對照組Smart bench測試結果	23
圖 3.14 實驗組Vellamo測試結果	24
圖 3.15 對照組Vellamo測試結果	25

 
表目錄
表 1 APP軟體測試評分對照表	25

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