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系統識別號 U0002-0908200512354000
中文論文名稱 應用矽膠微機電技術於微型壓力感測器之新型封裝
英文論文名稱 A New Packaging Method for Pressure Sensors by PDMS MEMS Technology
校院名稱 淡江大學
系所名稱(中) 機械與機電工程學系碩士班
系所名稱(英) Department of Mechanical and Electro-Mechanical Engineering
學年度 93
學期 2
出版年 94
研究生中文姓名 楊伯強
研究生英文姓名 Po-Chiang Yang
學號 692341158
學位類別 碩士
語文別 中文
口試日期 2005-07-01
論文頁數 44頁
口試委員 指導教授-杜文謙
共同指導教授-楊龍杰
委員-李宗昇
委員-戴慶良
委員-杜文謙
委員-康尚文
委員-楊龍杰
中文關鍵字 晶片等級封裝  聚二甲基矽氧烷  壓阻式壓力感測器 
英文關鍵字 wafer level package  PDMS  piezoresistive pressure sensor 
學科別分類 學科別應用科學機械工程
中文摘要 本文將介紹一應用於壓阻式壓力感測器之新型晶片等級封裝方式(wafer level package, WLP),主要是利用高分子矽膠材料聚二甲基矽氧烷(polydimethylsiloxane, PDMS),取代傳統的Pyrex #7740玻璃作為壓力感測器中,壓力薄膜下方空腔結構(pressure cavity)的密封材。使用聚二甲基矽氧烷作為封裝材料有許多優點,第一,聚二甲基矽氧烷表面經過氧氣電漿處理後,其親水性的表面與許多微機電製程材料,如矽、氧化矽、氮化矽等都有非常良好的鍵合效果,且其封裝過程皆為室溫製程。第二,其本身成本比其它矽質材料便宜許多。第三,其封裝製程時間僅需半小時,比起其它傳統封裝製程要來的快速。本文利用此新封裝材料與製程,製作PDMS新型封裝之壓阻式微型壓力感測器,300psi下之壓力測試結果初步驗證了輸出靈敏度與氣密性之要求。
英文摘要 This paper describes a novel wafer-level packaging method at room temperature for piezoresistive pressure sensors. We use polydimethylsiloxane (PDMS) to seal the wafer backside with V-grooves for pressure sensors. PDMS has several advantages in packaging herein. First, it can be bonded with many kinds of the materials (e.g., single-crystal silicon, silicon dioxide, silicon nitride, glass and another PDMS) after the hydrophilic surface treatment at room temperature. Second, it is much cheaper compared to other silicon-based materials (e.g., PDMS costs only US$100 per 1 kg for 50 times of usage on a 4 inch wafers at least). Third, the processing time is only half of hour and much shorter than other bonding processes. Based on the benefits mentioned above, we use PDMS to package the pressure cavities of the silicon pressure sensors.
The newly developed pressure sensors by this new method have been tested subject to different pressure conditions.(The maximum pressure for testing is 300 psi.) The output signals of the new sensors with PDMS packaging meets the performance requirement of good sensitivity and hermetic sealing.
論文目次 目錄
中文摘要………………………………………………Ⅰ
英文摘要………………………………………………Ⅱ
目錄…………………………………………………....Ⅳ
圖目錄…………………………………………………Ⅵ
表目錄…………………………………………………Ⅸ

第一章 緒論…………………………………………..1
1-1 研究動機…………………………………………..…1
1-2 研究目的…………………………………………..…2
1-3 文獻回顧…………………………………………..…3
1-4 研究架構…………………………………………..…5
第二章 壓阻式壓力感測器與PDMS介紹………….7
2-1 壓阻式壓力感測器……………………...…………..7
2-2 PDMS基本特性及介紹……………………………..8
2-2-1 PDMS的材料特性……..……………………..8
2-2-2 PDMS之優勢…………………………...……..10
第三章 製程…………………………………………16
3-1 矽質感測薄膜晶片製程……………………………16
3-1-1 製程介紹……………………………………….16
3-1-2 背面蝕刻………………………………...…….18
3-2 PDMS基底製程…………………………...……….20
3-3 封裝…………………………………………………23
第四章 實驗設備與測試……………………………25
4-1 實驗設備……………………………………………25
4-2 測試…………………………………………………27
第五章 結果與討論…………………………………28
第六章 結論…………………………………………33
6-1 總結……………………………………………….33
6-2 未來改進建議…………………………....……….35
參考文獻………………………………………………37
附錄A 硼離子掺雜…………………...……….……40
附錄B PDMS與矽晶片鍵合強度測試…………….42





圖目錄

圖 1-1 研究架構示意圖………………………………………6
圖 2-1 壓力薄膜構型剖面示意圖..…………………….…….7
圖 2-2 PDMS材料化學鍵結結構….....……………………9
圖 2-3 以毛細管在PDMS上製作對外孔洞…………..……13
圖 2-4 利用玻璃毛細管在PDMS上
製作之圓形流道........…..………………………...14
圖 2-5 利用五層PDMS堆疊之三維微流道………………..15
圖 3-1 壓力感測器製造流程………………………………..17
圖 3-2 晶片背面蝕刻流程圖………………………………..19
圖 3-3 保護治具………………...…………………………...19
圖 3-4 薄膜下方空腔結構.………………………..………...20
圖 3-5 PDMS與矽晶片母模……..…………………………21
圖 3-6 PDMS與鐵氟龍圓盤…...…………………………...21
圖 3-7 脫膜後之500μm厚PDMS薄膜……………………22
圖 3-8 脫膜後之45μm厚PDMS薄膜...…..……………….22
圖 3-9 壓力感測器晶片與PDMS封裝接合………………..24
圖 3-10 以500μm厚PDMS薄膜封裝之壓力感測器…..…24
圖 3-11 以45μm厚PDMS薄膜封裝之壓力感測器………24
圖 4-1 壓力測試機台...…...…………………………………26
圖 4-2 數據擷取機……...…...………………………………26
圖 4-3 設備連接示意圖…......………………………………26
圖 4-4 壓力感測器插入插卡式連接器…...…...……………27
圖 5-1 #4號壓力感測器以Pyrex #7740
玻璃封裝之輸出電壓………………………………...29
圖 5-2 #4號壓力感測器以500μm厚PDMS
封裝之輸出電壓…………………………………...…30
圖 5-3 #4號壓力感測器以45μm厚PDMS
封裝之輸出電壓………………………………………30
圖 5-4 #5號壓力感測器以Pyrex #7740
玻璃封裝之輸出電壓…….………………...………...31
圖 5-5 #5號壓力感測器以500μm厚PDMS
封裝之輸出電壓……………………………...………31
圖 5-6 #5號壓力感測器以45μm厚PDMS
封裝之輸出電壓…..……………………………….…32
圖 B-1 鋼製框架…………………………………………….43
圖 B-2 鋁製掛具…………………………………………….43
圖 B-3靜力量測示意圖……………………………………..43
圖 B-4 PDMS本體破裂狀況………………………………..44

















表目錄

表 2-1 壓力薄膜幾何參數……………………………………8
表 3-1 PDMS薄膜製程參數…………………………………22
表 5-1 三種不同封裝材之#4號壓力感測器性能比較…….30
表 5-2 三種不同封裝材之#5號壓力感測器性能比較…….32
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