台灣的封裝廠因客戶的需求所以半導體測試機台的功能不斷的提升，但是測試機台的成本相對的提高對於一般的半導體設計公司無法負荷如此高的成本，但為了節省成本多數的半導體設計公司還是會使用價格較低的機台量產，所以會使用許多方法讓現有的半導體測試機台可以量產例如Rolling Code [1]的量產及Memory Test[2]，已上兩種的測試需求較早期的半導體測試機台因記憶體的大小限制而無法逹到量產的需求，為了決解機台上的限制就必需對測試機台本身所制定的量產條件加以更動，讓半導體測試機台可以逹到量產的目的.
在本論文中介紹二種半導體測試機SC[2]和V7[4]的功能及測試機台記憶體取代的應用方式.

Packaging factory in Taiwan customer demand to the function of ATE continue to improve, but the ATE is relatively higher cost of semiconductor design companies in general can not load such a high cost, but to save the cost of most of the semiconductor design company will still use the lower price mass production machine, it will use many ways to make existing semiconductor production test machine for mass production such as Rolling Code [1]and Memory Test[2], test requirements has been the earlier of two ATE sets limits for the size of the memory can not Tat to production needs, solutions must drive the stage to restrictions on the test machine itself must be formulated to change the production conditions, so that the ATE can achieve a production purposes.
Described in this paper two kinds of ATE V7 [4], SC [3]the functions and memory test machine to replace the application mode.

中文摘要................................................I
英文摘要...............................................II
誌謝..................................................III
目錄...................................................IV
圖目...................................................VI
第一章	ROLLING CODE 及 MEMORY TEST....................1
1.1 ROLLING CODE 介紹...................................1
1.2 MEMORY TEST 介紹....................................2
1.3 ROLLING CODE 及 MEMORY TEST 量產之問題..............3
第二章 SC ATE 簡介......................................5
2.1 SC ATE硬體規格......................................5
2.2 I/O BOARD功能.......................................6
2.3 ADC BOARD功能.......................................7
2.4 PMU BOARD功能.......................................8
2.5 SEQ BOARD功能......................................10
2.6 SC ATE軟體簡介.....................................11
第三章 SC ATE 燒錄 Rolling Code 程式流程及方法.........13
3.1 SC ATE燒錄Rolling Code方法.........................13
3.2 SC ATE燒錄Rolling Code 流程........................13
3.3燒錄 Rolling Code程式解說...........................15
3.4驗証燒錄結果........................................17
第四章 V7 ATE 簡介.....................................19
4.1 V7 ATE硬體規格.....................................19
4.2 V7 ATE軟體介面.....................................20
第五章 V7 ATE 測試8K ROM 程式流程及方法(MEMORY TEST)...21
5.1 V7 ATE MCU ROM 測試方法............................21
5.2 V7 ATE MCU ROM 測試流程............................21
5.3 MCU ROM 測試程式解說...............................23
第六章 結論............................................25
References.............................................26

圖1.1 RF IC 使用 OTP WRITER 燒錄 ROLLING CODE ID 方塊圖....1
圖1.2 MCU IC 使用 ROM WRITER 寫讀 ADDRESS方塊圖............2
圖1.3 SC ATE 外觀..........................................4
圖1.4 V7 ATE 外觀..........................................4
圖2.1 SC ATE 測試頭外觀....................................5
圖2.2 I/O Board 方塊圖.....................................6
圖2.3 ADC BOARD 方塊圖.....................................7
圖2.4 ADC BOARD 方塊圖.....................................9
圖2.5 SEQ BOARD 方塊圖....................................10
圖2.6 PRF 檔..............................................11
圖2.7 TPF 檔..............................................12
圖3.1 十進位Rolling Code Data.............................13
圖3.2 SC ATE 燒錄 Rolling Code 流程.......................14
圖3.3 燒錄 Rolling Code 程式..............................15
圖3.4 指定開檔路徑開啓 Rolling Code 檔案..................16
圖3.5 ID_Gen Stage 流程方塊圖.............................16
圖3.6取代測試Pattern 指令.................................17
圖3.7程式執行結果.........................................18
圖4.1 V7 ATE PC主機及測試頭外觀...........................19
圖4.2測試程式控制介面.....................................20
圖5.1V7 ATE MCU ROM 測試流程方塊圖........................22
圖5.3 驗証結果............................................24
圖5.4 V7 ATE 程式說明方塊圖驗証結果.......................24

[1]“Rolling Code 的使用”，ALPHA，2010-02-12
[2]R. Dekker,F. Beenker,and L. Thijssen,"Fault modeling and test algorithm development for static randomaccess memories" in Proc. IEEE Int. Test Conf,October 1988。
[3]Credence SC212 Maintenance Course Manual,November 2000。
[4]VTT V7100 Manual,January 1999.
[5]彭靖灝”System.IO”，June 2005。
[6]Chang,Chieh-fu“Quantization Effects on Weak Signal in a Software Receiver Using FEW Bits ADC and Corresponding Sampling Schemes”,October 2006。
[7]“MDT10P123 8BIT ROM” Micon Design Technology Co,June 2010。
[8]“60H321 RF MCU”Mosart Design Technology Co,July 2010。